Project | Prototype | Mass production |
---|---|---|
Layers | 2-32L ( HDI Anylayer ) | 1-18L ( HDI 3+N+3 ) |
Base Material | FR-4, Aluminum (Shengyi, KB, ILM,ITEQ, Ventec, Rogers etc) | FR4, RO4003/4350/3003, Panasonic M6, ISOLA 406/410,Ventec etc |
Acceptable files/datas | Gerber 274, Gerber D, Eagle, DPF, MDA, DXF Protel99se, ODB++, IPC-D-350 | Gerber 274, Gerber D, Eagle, DPF, MDA, DXF Protel99se, ODB++, IPC-D-350 |
Twist & Warp | Double side multi-layers D≤0.075% | Double side multi-layers D≤0.075% |
Layer Registration Tolerance | >=2mil | >=3mil |
Max.board size | 600*1500MM | 600*1200MM |
Min. Board size | 10*5mm(Thickness>0.4mm) | 10*10mm(Thickness>0.4mm) |
Finished thickness | 1/2Layer:0.25-4.5mm(min:0.6mm for HAL) | 1/2Layer: 0.4-3.5mm(min:0.6mm for HAL) |
Ratio Rate | 1:12 | 1:8 |
Hole Size tolerance | PTH:0.075mm NPTH:0.05mm | PTH:0.075mm NPTH:0.05mm |
Hole location tolerance | PTH:0.05mm NPTH:0.05mm | PTH:0.075mm NPTH:0.075mm |
Mechamical Drilling | 0.15mm-6.0mm | 0.15mm-6.0mm |
Laser Drilling | 0.075mm (3mil) | 0.1mm (4mil) |
Outline tolerance | Punching: +/-0.1MM Routing: +/-0.13MM V-CUT: +/-0.1MM Depth routing:+/-0.1MM Beveling: +/-0.1MM | Punching: +/-0.1MM Routing: +/-0.13MM V-CUT: +/-0.1MM Depth routing:+/-0.1MM Beveling: +/-0.1MM |
Board thickness tolerance | ≤20mil : ±3mil(2L) | ≤20mil : ±3mil(2L) 20mil<x<62mil : ±4mil(2L,Multilayer) <62mil : ±10%(2L,Multilayer) |
Min.Line width/space (Finished) | 1/3OZ : 2.5/2.5mil(min) H/Hoz : 3.0/3.0mil(min) 1/1oz :3.0/3.5mil(min) 2/2oz : 5.0/4.0mil(min) 3/3oz : 7.0/5.0mil(min) | 1/3OZ : 2.5/2.5mil(min) H/Hoz : 3.0/3.0mil(min) 1/1oz : 4/4.0mil(min) 2/2oz : 6.0/5.0mil(min) 3/3oz : 8.0/6.0mil(min) |
Surface treatment | HAL (Lead Free),ENIG, Immersion Ag/Tin,OSP, Gold plating | HAL (Lead Free),ENIG, Immersion Ag/Tin,OSP, Gold plating |
Impedence | Single : 50-90 ohm+/-10% Difference: 60-120 ohm+/-10% | Single : 50-100 ohm+/-10% Difference: 60-120 ohm+/-10% |