We have 6 SMT lines, fully automated with :

  PCB Stacker/Destacker

  Removing/placing solder paste with 2D inspection

  Placement machines Pick and Place

  Reflow oven

  X-ray inspection

The products are qualified from prototypes to mass production, with the same recommendations and the same machines.

Reflow soldering is a thermal process used to permanently attach surface-mount components (SMDs) to the pads of a printed circuit board (PCB) by heating solder paste until it melts, flows, and solidifies.

It is the most widely used soldering technique in automated SMT (Surface Mount Technology) assembly lines due to its repeatability, compatibility with fine-pitch components, and ability to handle complex board layouts.

In electronics, we're talking about soldering which uses temperatures below 450°C.

Wave soldering : ROHS tin or lead bath

Selective wave soldering : wave “finger” by a conventional soldering head driven in X, Y, Z

With the latter, we use an automated point to point soldering technique, replacing the soldering iron.

Our soldering process is RoHs qualified, but we also keep the leaded process for certain activities.

Our soldering is carried out in an inert atmosphere with nitrogen supply that reduces the level of oxygen to improve the wettability of the solder.

Technological capabilities of SMD assembly :

   Minimal size of discrete component:   0201 

   integrated circuits and connectors - minimal  pitch 0.35mm,

   uBGA, BGA, QFP, MLF, PLCC

   Daily production capacity: 800K points per day 

   Max.PCB size : 450*500mm 

   Part thickness:  0.5mm ≤T ≤ 3mm

   Max Parts size assembly by machine:  SMD ≤ 200*125mm

   PCB type: Rigid PCB,flex pcb, Semi-flex pcbs