We have 6 SMT lines, fully automated with :
PCB Stacker/Destacker
Removing/placing solder paste with 2D inspection
Placement machines Pick and Place
Reflow oven
X-ray inspection
The products are qualified from prototypes to mass production, with the same recommendations and the same machines.
In electronics, we're talking about soldering which uses temperatures below 450°C.
Wave soldering : ROHS tin or lead bath
Selective wave soldering : wave “finger” by a conventional soldering head driven in X, Y, Z
With the latter, we use an automated point to point soldering technique, replacing the soldering iron.
Our soldering process is RoHs qualified, but we also keep the leaded process for certain activities.
Our soldering is carried out in an inert atmosphere with nitrogen supply that reduces the level of oxygen to improve the wettability of the solder.
Technological capabilities of SMD assembly :
Minimal size of discrete component 0201,
integrated circuits and connectors - minimal pitch 0.35mm,
uBGA, BGA, QFP, MLF, PLCC
Max.PCB size : 450*500mm
Part thickness: 0.5mm ≤T ≤ 3mm
Max Parts size assembly by machine: SMD ≤ 200*125mm
PCB type: Rigid PCB,flex pcb, Semi-flex pcbs